2022-2023中国半导体IC研发制造数智化服务商研究报告.pptx
2022-2023 IC IC 2022 IC IC IC IC IC know-how IC IC 2022 IC TOP30 2022 IC TOP10 2022 Gordon Moore 1965 18 50 EDA Electronic design automation EDA CAD PCB Printed Circuit Board CIM Computer Integrated Manufacturing CIM MES Manufacturing Execution System MES APC Advanced Process Control APC EAP Equipment Automation Programming EAP ERP Enterprise resource planning ERP.WMS:Warehouse Management System AMHS Automatic Material Handling System AMHS)OHT(Overhead Hoist Transport OHT AGV(Automated Guided Vehicle AGV)AMR(Autonomous mobile mobile AMR AI ML STB Side Track Buffer,STB C O N T E N T S 1.2.IC 3.IC 01 IC 02 IC 1.2.3.03 IC 1.2022 IC 2.IC 04 IC 1.2.3.C O N T E N T S 1.2.IC 3.IC 01 IC 02 IC 1.2.3.03 IC 1.2022 IC 2.IC 04 IC 1.2.3.6 1.1.1 IC IC IC AI IC IC Integrated Circuit IC IC IC IC IC IC 80%IC IC CMP IC EDA IC IP 7 1.1.2 IC EDA IP ERP MES SCM YMS EAP RTD WMS PLM APC AMHS OHT/OHS/AMR/AGV/Stocker-IC IC IC IC-IC IC IC IC 8 1.2 IC IC IC IC IC IC IC IC IC/9 IC 22.6 27.2 35.8 39.2 17.4 21 24.9 28.8 31.3 31.7 37.2 2016 2017 2018 2019 2020 2021()()2016-2021 45.5 1.2.1 2016-2021 IC IC 150+74%4122 4688 4121 4390 5559 1925 3389 1075 2016 1313 2017 1582 2018 1445 2019 1517 2020 2021()2016-2021 2296 2588 3104 3050 3515 4333 698 663 837 1017 1180 1545 30.4%25.6%27.0%33.3%33.6%35.7%2019 2020 2021 2016 2017 2018/%34.6%27.1%8.6%7.9%21.9%10 IC 2022 1.2.2 IC IC 76.7 54.1 2023 2020 IC IC 16.0 18.1 20.0 14.4 17.2 18.1 15.7 15.9 16.0 46.1 51.2 54.1 2018 2019 2020 59.7%9.9%13.8%1.4%1.2%4.4%IT 2022 IC 2018-2020 IC IC 1.2.3 2018-2022 2015,2017 2021 2020 2020 2021 2014-2022 2014 2015 2025 2021 2035 IC 2017 2020 2022 2018 FIRRMA 2018 ECRA 2020 AF A 2022 12 IC 1.2.4 2018-2022H1 689.9 861.9 2316.3 2013.7 797.5 349 373 478 686 318 2018 2019 2020 2022H1 2021 48.6%3.6%8.0%19.6%11.6%8.6%IC IC IC 2022 IC 1387.2 2041.5 67.0%17.0%10.0%19.6%IC IC IC 1.2.5 IC/2021 17000 1781.8 718.7 13.3%15.0%3031 33.6%16.0%3.5-5%EBIT 1-2%0.3-0.5%0.5-1%3.5-5%0.4-0.8%EDA IP Synopsys Cadence Mentor Graphics IC IDM FAB Intel IC ASE Amoker IC GE SAP 2022 IC 250 2025 464 2020-2025 18.3%IC IC 2022 IC 1.3 IC 8848.0 10458.0 11386.0 13577.8 16191.5 19308.4 2020 2021 2024E 2025E 2022E 2023E IC CAGR 16.9%200.0 210.0 250.9 304.7 373.9 2020 2021 2024E 2025E 2022E 2023E IC CAGR 18.3%2020-2025 IC 2020-2025 IC 464.0 14 C O N T E N T S 1.2.IC 3.IC 01 IC 02 IC 1.2.3.03 IC 1.2022 IC 2.IC 04 IC 1.2.3.16 IC 2.1 17 2.2.1 IC know-how IC Know-how IC IC IC 18 IC IC 10 IC 2.2.2 IC/IC IC 2.25 3.5 4.25 IC IC 3 3.5 2.75 2.3.1 IC IP IC 2.3.1 1 2 3 4 BOM 21 2.3.2 IC EDA EDA IC IC EDA IC EDA Synopsys Cadence Mentor Graphics EDA EDA IC EDA IC 2020 EDA 100 4000 IC 4000 IC EDA 100 IC IC IC IC IC EDA IC EDA P C B EDA PCB 32.14%23.40%14%30.5%Synopsys Cadence Mentor Graphics 2020 EDA EDA 2020 10-40 EDA 2020 0.5-5 EDA EDA 2020 0.5 2.3.2 IC EDA EDA EDA EDA EDA EDA IC EDA E D A EDA EDA EDA EDA EDA EDA EDA EDA EDA IC EDA EDA EDA E D A EDA EDA IC EDA EDA IC IC EDA AI EDA IC IC IC IC AI EDA EDA EDA EDaaS IC 2.3.2 IC EDA IC EDA EDA EDA EDA EDA EDA EDA EDA EDA 1 2 3 4 CPU 20%80%-90%EDA vendor vendor EDA EDA 70%20%10%EDA 24 IC IC IC IC 2.3.3 IC IC IC OT IT 69%2021 8 12 25%8 12 8 12 8 12 1127 1448 1818 2149 2560 3176 25.1%28.5%25.6%18.2%19.1%24.1%2016 2017 2018 IC 2019 2020 2021 IC%2016-2021 IC 25 CIM MES EAP APC RTD APS IC 2.3.3 IC CIM IC&WMS PLM ERP SRM BI KPI MES RTD SPC APS APC R2R OEE FDC RMS EAP QMS Defect SPC YMS MFA ADC TMS AMHS OHT AMR Stoker STB MCS OCS 26 AI ML IC IC 2.3.3 IC IC IC EAP MES MES APS AI AI/IC IC IC IC IC 2.3.4 IC IC IC IC IC ROE IC IC IC ROE 21%15%12%21%IC IC IC IC 2.3.4 IC I/O I/O 5G 5G 5G ID IC IC ICA IC 390 430 290 420 2019 2025E 28 29 2022 2.3.5 IC class100 20%-75%IC 2020Q2 2021Q2 2022Q2 2022Q2 IDM 89.69 88.17 121.7 38.03%IDM 54.05 45.37 56.29 24.07%Fabless 23.43 31.33 54.18 72.93%IDM 21.36 18.56 21.99 18.48%Fabless 14.01 21.14 38.89 83.96%AMD Fabless 13.24 17.65 26.48 50.03%2022 554.7 6.2%35.6%88 94 2020-2022 Q2 30 2.3.5 AMHS AMHS MES ERP AMHS A M H S OHT AGV AMR STB Stoker MCS OCS VCS ERP MES ERP WMS MES WMS 2.3.6 IC IC know-how IC IC 32 2.3.6 OCR NLP RP A C O N T E N T S 1.2.IC 3.IC 01 IC 02 IC 1.2.3.03 IC 1.2022 IC 2.IC 04 IC 1.2.3.3.1.1 2022 IC TOP30 2022 IC TOP30 3.1.2 2022 IC TOP10 2022 IC TOP10 36 IC LED ERP 3.2.1 ERP+Fabless-Foundry-/SAP Oracle EXCEL ERP-ERP fastone+20 75%3.2.2 EDA IT IT Delay IC IT IT EDA IC Foundry PaaS IT EDA PaaS x86 EDA WEB Slurm/SGE/L SF EDA 38 2018 TCL TCL 3.2.3 AI MES CIM EAP SPC ADC MFA FDC EHM EMS CMS 39 ERP 1998 IC IC IC 3.2.4 WIP IMES SPC OE/EMS EPM IEW IMES ENT OP SYS INV SMD PRS ISU PRT QC PRD EQP MTL USR IMES LED 40,3.2.5 YOUITMS Youifleet 20 YOUI TMS YOUI Fleet SEMI 30%66%3.2.6 OA IC EDA FPGA OA IC OA OA C O N T E N T S 1.2.IC 3.IC 01 IC 02 IC 1.2.3.03 IC 1.2022 IC 2.IC 04 IC 1.2.3.4.1 1-2 3-5 2 6 2 60%30%20%60%20%10%1-2 KPI AI KPI 3-5 44 4.2 2019.01 2020.01 2021.01 PC+2022 2022.01 45 4.3 Know-how know how IT IT T H A N K Y O U
