20231122_甲子光年_中国工业视觉技术实践系列报告：泛半导体行业的质量管理技术升级之路_31页.pdf
2023.11 Part 01 Part 02 Part 03 Part 04 1ZAZxOrMtQmNoQsRnQqPoPbRbPbRtRrRtRtQfQnMmNeRtRsR7NnMsMuOnPzRvPnPrR 64 256 10bit 12bit 16bit 0.1 10 1000 400nm-750nm X AI CMOS CCD LED 3C 2017 2022 GDP 2022 447 2026 1000 20%597610113917822328.1%29.4%27.1%26.2%27.4%27.7%2017 2018 2019 2020 2021 2022 GDP%2017-2022 GDP 2016-2026 122 150 180225293366447546668818100023%20%25%30%25%22%22%22%22%22%2016 2017 2018 2019 2020 2021 2022 2023E 2024E 2025E 2026E%2022 184 2025 470 2020-2025 2020-2025 7208088839941124128112%9%13%13%14%2020 2021 2022 2023E 2024E 2025E%9513918426435647046%32%43%35%32%2020 2021 2022 2023E 2024E 2025E%2023 4 2022 8 2022 1 2021 12 2021 7 5G 2021-2023 5G AR/VR AGV 5G 5G 5G+2021 3 2020 11 2020 2 2016 2020 2021 /Vision Pro lisence GPU HALCON OpenCV:eVision HexSight;NI Vision /3D 3D 3D()3C 3C 3C 3C()Part 01 Part 02 Part 03 Part 04-3C 3C 554 544 590 626 614 654 811 819 269 272 298 329 331 352 444 428 2015 2016 2017 2018 2019 2020 2021 2022 PCB PCB 2015-2022 PCB 231.5215.2 215.8206.3195.6201.1237.92320%10%20%0501001502002502015 2016 2017 2018 2019 2020 2021 2022 2013-2022 iPhone 3C 1/2)3C 3C 3C PCB PCB SMT/PCB PCB PCB PCB PCB LED PCB PCB USB 3C 2/2)(Array)(Cell)(Module)Array/Cell Module Color Film ACF IC BLU TPCDAOIADI-AOIAMI-AOI AOI Cell TestIn-LineOpenCellSystem PI Inspection PI MAC/MIC Seal InspectionBonding AOI AOI Array Yester CF CF PS Total Pitch AOIMAC/MICCD/HI-2022 243GW 41%2023 2022 86GW 61%80%0.4 2023 400GW 1600 20 GW GW 75 97 98 102 128 172 243 377 463 533 29%1%5%25%34%41%56%23%15%2016 2017 2018 2019 2020 2021 2022 2023E 2024E 2025E GW%33 52 43 29 47 54 86 119 119 124 55%-17%-33%63%14%61%38%0%4%2016 2017 2018 2019 2020 2021 2022 2023E 2024E 2025E GW%-1/2)SEAJ 2022 1077 5 CAGR 13.7%2022 282.7 5 CAGR 21.2%(65 82 131 134 187 269 283 391 449 26%60%2%40%44%5%38%15%2016 2017 2018 2019 2020 2021 2022 2023E 2024E%3407 4147 4704 4147 4425 5578 5818 1111 1361 1649 1476 1543 1909 1880-20.00%-10.00%0.00%10.00%20.00%30.00%020004000600080002016 2017 2018 2019 2020 2021 2022 2016-2022-2/2)SEMI 2021 2023 84 20/319 300 324 393 429-6%8%21%9%2018 2019 2020 2021 2022%17 17 23 33 28 2019 2020 2021 2022 2023E 1/4)CMP CMP Pad/&ATE Automatic Test Equipment Handler Wafer Prober 2/4)50%500 99.99%95%99.98%90%(Metrology)Inspection(CD),;Kaempf 3/4)Center-Donut,Edge-Loc Edge-Ring Local Near full Random Scratch 4/4)Automatic Optical Inspection AOI AOI AOI AOI 100%ESD AOI AOI PC Part 01 Part 02 Part 03 Part 04 3C 2016-2025 3C 24 27 31 41 43 49 56 62 15%14%29%5%14%13%12%2018 2019 2020 2021 2022 2023E 2024E 2025E%2016-2025 6 1010 14 20 28 38 5561%0%40%43%40%36%45%2018 2019 2020 2021 2022 2023E 2024E 2025E%AI GTI GTD GTO AI AI AI AI AI 2D+3D AI GTI AI 2 8 GTI AI GT AI Inside 0.225um WPH 1.5、Recipe 100%AI AI FPC AI SLP AI AI 20+5+5+9395%GTI-PMI AI 100%AI GTI-PMI AOI+99.9%1%90%CMP AOI AOI AOI AOI AOI AOI AOI AOI CP(Chip Prbing)CMPCVD/PVD/AOI AOI AOI2D/3D AOI+AOI2D/3D AOI Die Mount Die Saw Wire bond Mold AOI AOI RDL AOI Part 01 Part 02 Part 03 Part 04 2D 3D AIGC 2023 2D 80 90 3C 3C AI 80 90 2000 2014 2020 2030 2D 2D 3D AI AI ChatGPT AI AlexNet ReLU Dropout LRN)ResNet FractalNets Self-AttentonVision-Transformatior Transformer/GAN G D 3D 3D AOI 3D 3D 2D 3D 3D 2D AOI 3D AOI 2D AOI 2D 3D AOI 3D 3D AOI 3D AOI 2D AOI 3D AOI 3D AOI 2D AOI 3D AOI 3D AOI 3D 3D AOI 3D AOI .D.:,2021.D.:,2022.J.,2023,59(8):190-192.,.3D-AOI J.,2023(4):71-73,81.,.J.,2023(5):22-24.,.J.,2023(4):143-156.,.J.,2023,40(4):967-977.D.,2023.D.,2023.D.,2013.D.,2019.stgg_6406 18401669467 AR/VR 18600783813&
