GTI Sub-6GHz 5G Device Whitepaper 1 GTI Sub-6GHz 5G Device White Paper GTI Sub-6GHz 5G Device Whitepaper 2 GTI Sub-6GHz 5G Device White Paper Version: V2.0 Deliverable Type Procedural Document Working Document Confidential Level Open to GTI Operator Members Open to GTI Partners Open to Public Working Group Terminal WG Task Source members CMCC, Sprint, Anritsu, Intel, Mediatek, OPPO, Qualcomm, R Physical channels and modulation, v15.0.0 2 3GPP, TS 38.212, NR; Multiplexing and channel coding, v15.0.0 3 3GPP, TS 38.213, NR; Physical layer procedures for control, v15.0.0 4 3GPP, TS 38.214, NR; Physical layer procedures for data, v15.0.0 5 3GPP, TS 37.340, NR; Multi-connectivity Stage 2, v15.0.0 6 3GPP, TS 38.300, NR; Overall description; Stage-2, v15.0.0 7 3GPP, TS 23.501, NR; System Architecture for the 5G System Stage-2, v15.0.0 8 3GPP, TR 36.824, V11.0.0 9 3GPP, R4-1700977, Discussion on High power UE for 3.5GHz 5G NR, CMCC 10 3GPP, R4-1706068, WF on high power UE for 3.5GHz, CMCC, Skyworks, Qorvo, Broadcom, MediaTek, Vodafone, CATT, Huawei, HiSilicon, ZTE 11 3GPP, RP-142307, New SI proposal: Performance enhancements for high speed scenario, NTT DOCOMO, INC., Huawei, HiSilicon, Dec. 2014 12 3GPP, R4-150554, High speed train scenarios, CMCC, Feb. 2015 13 3GPP, R4-166805, Way forward on UE performance enhancement under SFN scenario, Huawei, HiSilicon, NTT DOCOMO, Qualcomm Incorporated, MediaTek Inc. , CMCC, CATT, ZTE, Ericsson GTI Sub-6GHz 5G Device Whitepaper 11 14 3GPP, TS36.101, Annex B, Propagation Conditions, v14.4 15 3GPP, R4-157700, Enhance UE performance under SFN scenario, Huawei 16 3GPP, R4-165823, View on the reference receiver for high speed train enhancement, MediaTek 17 3GPP, TS38.211, Section 7.4.1, Reference Signals, v2.00 18 3GPP, R2-1708011 Thermal mitigation in NR UEs, Mediatek 19 3GPP, R1-1710838 Cross-slot scheduling for UE power saving, Mediatek 20 M. Lauridsen, P. Mogensen, and L. Noël. Empirical LTE Smartphone Power Model with DRX Operation for System Level Simulations, IEEE 78th Vehicular Technology Conference, Sep 2013. 21 B. Murmann, ADC Performance Survey 1997-2017, Online. Available: web.stanford.edu/murmann/adcsurvey.html. 22 3GPP, R1-167531 Area, power and latency comparison for NR high throughput decoder, Qualcomm 23 A.Stillmaker and B.Baas, Scaling equations for the accurate prediction of CMOS device performance from 180nm to 7nm Integration, the VLSI Journal June 2017 24 3GPP, R1-1612067 Evaluation of frame structure design for UE Power Consumption, Qualcomm 25 3GPP, R5-176537 WP UE Conformance Test Aspects - 5G system with NR and LTE, Ericsson